Improving GPU server heat dissipation with high thermal conductivity interface material.

The era of AI artificial intelligence is coming. For computing the GPUs generate a significant amount of waste heat during AI computation. Existing thermal interface materials mostly rely on polymer-based thermal pastes, which have a thermal conductivity of approximately 5 W/m.K. They are unable to efficiently dissipate heat in a timely manner. This invention proposes the use of metal as a replacement for polymer-based thermal paste as a thermal interface material, with a thermal conductivity of about 56.18 W/m.K. By employing metal as the thermal interface material, the heat of the GPU can be rapidly expelled, allowing the GPU to operate in a lower temperature environment.